1 n-channel 100-v (d-s) mosfet features ? trenchfet ? power mosfets ? 175 c junction temperature ? low thermal resistance package prod uct summary v (br) dss (v) r ds(on) ( )i d (a ) 100 0.030 at v gs = 10 v 40 0.034 at v gs = 6 v 37.5 d g s n-channel mosfe t notes: a. duty cycle 1 % . b. see soa curve for voltage derating. c. when mounted on 1" square pcb (fr-4 material). * pb containing terminations are not rohs compliant, exemptions may apply. absolute maximum ratings t c = 25 c, unless otherwise noted p arameter symbol limit unit drain-source voltage v ds 100 v gat e-source voltage v gs 20 contin uous drain current (t j = 175 c) t c = 25 c i d 40 a t c = 125 c 23 pulsed drain current i dm 75 a valanche current i ar 35 repetitiv e avalanche energy a l = 0.1 mh e ar 61 mj maximum power dissipation a t c = 25 c p d 10 7 b w t a = 25 c c 3.75 ope rating junction and storage temperature range t j , t stg - 55 to 1 75 c thermal resistance ratings p arameter symbol limit unit junction-to-ambient (pcb mount) c r th ja 40 c /w junction-to-case (drain) r th jc 1.4 a v ailab le rohs* compliant to-252 s gd top v iew d 5 6 / www.daysemi.jp
2 no tes: a. pulse test; pulse width 300 s, duty cycle 2 % b. guaranteed by design, not subject to production testing. c. independent of operating temperature. st resses beyond those listed under ?absolute maximum ratings? ma y cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. s pecifications t j = 25 c, unless otherwise noted p arameter symbol test conditions min. typ. max. unit static drain-source breakdo wn voltage v ( br)dss v ss = 0 v , i d = 250 a 100 v gate-thre shold voltage v gs( th) v ds = v gs , i d = 250 a 24 gate-b ody leakage i gss v ds = 0 v , v gs = 20 v 100 na zero gate voltage drain current i dss v ds = 80 v , v gs = 0 v 1 a v ds = 80 v , v gs = 0 v , t j = 125 c 50 v ds = 80 v , v gs = 0 v , t j = 175 c 25 0 on-state drain current a i d( on) v ds 5 v , v gs = 1 0 v 75 a drain-source on-state resistance a r ds( on) v gs = 10 v , i d = 15 a 0.024 0.030 v gs = 6 v , i d = 10 a 0.026 0.034 v gs = 10 v , i d = 15 a, t j = 125 c 0.054 v gs = 10 v , i d = 15 a, t j = 175 c 0.067 forward transconductance a g fs v ds = 15 v , i d = 15 a 10 s dy namic b inpu t capacitance c iss v gs = 0 v , v ds = 25 v , f = 1 mhz 2400 pf output capacitance c oss 270 re verse transfer capacitance c rs s 90 t otal gate charge c q g v ds = 50 v, v gs = 10 v, i d = 4 0 a 35 60 nc gate-source charge c q gs 11 gate- drain charge c q gd 9 g ate resistance r g 1.7 tu r n - o n d e l ay t i m e c t d(on ) v dd = 50 v , r l = 1.25 i d ? 40 a, v gen = 10 v, r g = 2.5 11 20 ns rise time c t r 12 20 turn-off delay time c t d(off) 30 45 fall time c t f 12 20 so urce-drain diode ratings and characteristics t c = 25 c b co ntinuous current i s 40 a pulse d current i sm 75 f orward voltage a v sd i f = 30 a, v gs = 0 v 1.0 1.5 v reverse recovery time t rr i f = 30 a, di/dt = 100 a/s 60 100 ns peak reverse recovery current i rm( rec) 58 a reverse recovery charge q rr 0.15 0.4 c d 5 6 / www.daysemi.jp
3 typica l characteristics 25 c, unless otherwise noted outp ut characteristics transconductance capacitance 0 15 30 45 60 75 0 246810 v ds - drain-to-source voltage (v) v gs = 10 thr u 6 v 4 v - drain current (a) i d 5 v 0 20 40 60 80 100 0 1530456075 - transconductance (s) g fs t c = - 55 c 25 c 125 c i d - drain current (a) 0 600 1200 1800 2400 3000 0 20406080100 v ds - drain-to-source voltage (v) c - capacitance (pf) c is s c os s c rss tran sfer characteristics on-resistance vs. drain current gate charge 0 15 30 45 60 75 0 123456 v gs - gate-to-source voltage (v) - drain current (a) i d 25 c - 55 c t c = 125 c 0.00 0.02 0.04 0.06 0.08 0 1530456075 i d - drain current (a) v gs = 10 v - on-resistance ( ) r ds(on) v gs = 6 v 0 4 8 12 16 20 0 10203040506070 - gate-to-source voltage (v) q g - total gate charge (nc) v gs v ds = 50 v i d = 40 a d 5 6 / www.daysemi.jp
4 ty pical characteristics 25 c, unless otherwise noted on -resistance vs. junction temperature avalanche current vs. time (nor malized) - on-resistance r ds(on) 0.0 0.5 1.0 1.5 2.0 2.5 - 50 - 25 0 25 50 75 100 125 150 175 t j - junction temperature (c) v gs = 10 v i d = 15 a t in (s) 1000 10 0.00001 0.001 0.1 1 0.1 (a)i da v 0.01 i av (a) at t a = 150 c 100 1 0.0001 i av (a) at t a = 25 c sou rce-drain diode forward voltage drain-source breakdown voltage vs. junction temperature v sd - source-to-drain voltage (v) - source current (a) i s 100 10 1 0.3 0.6 0.9 1.2 t j = 25 c t j = 150 c 0 95 100 105 110 115 120 125 130 - 50 - 25 0 25 50 75 100 125 150 175 t j - junction temperature (c) i d = 10 ma dr ain-source breakdown voltage (v) d 5 6 / www.daysemi.jp
5 thermal ratings maxim um avalanche and drain current vs. case temperature 0 10 20 30 40 50 0 25 50 75 100 125 150 175 t c - ambient temperature ( c) - drain current (a) i d s afe operating area 1000 10 0.1 1 10 1000 0.1 100 t c = 25 c single pulse - drain current (a) i d 1 ms 10 ms dc , 100 ms 10 s 100 s 1 100 limited by r ds (on) * v ds - drain-to-source v oltage (v) * v gs minimum v gs at which r ds (on) is specified norm alized thermal transient impedance, junction-to-case square wave pulse duration (s) 2 1 0.1 0.01 10 -4 10 -3 10 -2 10 -1 1 nor malized eff ective transient thermal impedance 0.2 0.1 duty cycle = 0.5 single pulse 0.05 0.02 d 5 6 / www.daysemi.jp
1 to-252aa case outline no te ? dimension l3 is for reference only. l3 d l4 l5 b b2 e1 e1 d1 c a1 gage plane height (0.5 mm) e b3 e c2 a l h millimeters inches dim. min. max. min. max. a 2.18 2.38 0.086 0.094 a1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 b3 4.95 5.46 0.195 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.89 0.018 0.035 d 5.97 6.22 0.235 0.245 d1 5.21 - 0.205 - e 6.35 6.73 0.250 0.265 e1 4.32 - 0.170 - h 9.40 10.41 0.370 0.410 e 2.28 bsc 0.090 bsc e1 4.56 bsc 0.180 bsc l 1.40 1.78 0.055 0.070 l3 0.89 1.27 0.035 0.050 l4 - 1.02 - 0.040 l5 1.14 1.52 0.045 0.060 ecn: x12-0247 -rev. m, 24-dec-12 dwg: 5347 package information
1 application note rec ommended minimum pads for dpak (to-252) 0.420 (10.668) recommended mi nimum pads dimensions in inches/(mm) 0.224 (5.690) 0.180 (4.572) 0.055 (1.397) 0.243 (6.180) 0.087 (2.202) 0.090 (2.286) return to index re turn to index application note
legal disclaimer notice www. daysemi.jp 1 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards. legal disclaimer notice www.daysemi.jp revision: 02-oct-12 1 document number: 72610 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
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